SPI2 Virtual Industry Info Session (Aug 2022)

Please consider joining the August 2022 SPI2 information session to learn about opportunities to engage with researchers in the burgeoning area of SPI2: Spatial Packaging of Interconnected Systems with Physical Interactions. Recent breakthroughs at the interface of multidisciplinary design optimization, mathematics, computational geometry, and other domains have opened the door for the first time to holistic design automation of 3D SPI2 design problems.

When: Aug 2, 2022 11:00 AM Central Time (US and Canada)

Register in advance for this Zoom webinar: https://illinois.zoom.us/webinar/register/WN_jac4QYXPRkKEdcdI5QxRsg

Session Goals:

  • Discover the needs of SPI2 Stakeholders: SPI2 System Designers, Tool Creators, and Researchers 
  • Connect SPI2 stakeholders from diverse industries and cultivate a SPI2 community with the common interest of transforming how SPI2 is done in practice 

Session Activities:

  • Introduce SPI2 and the critical need for fundamentally new design strategies
  • Present our vision for a SPI2 research and practice ecosystem 
  • Explicit opportunities for active discussion among participants
  • Introduce specific engagement opportunities for SPI2 stakeholders, such as consortium memberships or direct collaborations

Next Steps Beyond the Information Session:

  • Strategic topical and project-focused follow-up meetings 
  • Fall in-person workshop at UIUC, tentatively scheduled for November 16-17
  • Formation of advisory boards
  • Proposal writing and team building

SPI2 Background:

SPI2 refers to 3D Spatial Packaging of Interconnected Systems with Physical Interactions. Recent breakthroughs are enabling for the first-time automated design of SPI2 systems. These new holistic SPI2 design methods stand to completely transform design and manufacturing capabilities across a wide swath of engineering application domains, from chips to ships and essentially everything in between. This is an important opportunity for companies and other stakeholders to join this collective effort early, and to be part of the creation of new advanced SPI2 design methods and their refinement and translation into practice. Partners will have an opportunity to be among the first engineering organizations that break free of the manual design tasks that limit SPI2 system complexity and the pace of technological advancement. SPI2 research is at the center of a large initiative supported by the UIUC Grainger College of Engineering that aims to build a sustainable ecosystem for SPI2 design research and practice. 

SPI2 design automation has the potential for tremendous impact on applications where the placement of heterogeneous components within tight, complex spaces and routing of their interconnects (wiring, fluid channels, etc.) currently relies at least in part on manual human design tasks, and involves the added complexity of spatially-dependent physical interactions, such as heat transfer, electromagnetics, and structural vibrations, as well as life-cycle processes (assembly, maintainability, etc.). The UIUC SPI2 team has helped translate SPI2 design automation into practice in collaboration with several automotive and aerospace companies (and engineering software tool companies), focusing on select applications of practical importance. We are seeking to both deepen our engagement with companies in these domains, as well as diversify our engagement with other technical sectors, such as biomedical devices and microelectronics. 

There are several options for stakeholders to engage with us and our collaborators, including joining a research consortium, a possible NSF IUCRC, joining an external advisory board for other large-scale proposed projects, and direct collaboration on technical SPI2 projects. Please feel free to direct any questions to Prof. James Allison (jtalliso@illinois.edu) or Dr. Satya Peddada ( speddad2@illinois.edu). To learn more about 3D SPI2 research, please visit our website at: https://spi2.illinois.edu/.